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Shenzhen Wisdomshow Technology Co.,ltd
Shenzhen Wisdomshow Technology Co.,ltd
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0.8mm 8cm BGA Reballing Machine

Shenzhen Wisdomshow Technology Co.,ltd
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0.8mm 8cm BGA Reballing Machine

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MOQ : 1unit

Price : USD 8000-9500/unit

Payment Terms : L/C, D/P, T/T, Western Union

Supply Ability : 200 units/month

Delivery Time : 5-7 working days

Packaging Details : wooden package

Product Name : BGA Reballing Machine

Power : 6800W

Power Supply : Single Phase

PCB thickness : 0.5-8mm

GA size : 0.8mm-8cm

Mounting BGA weight : 1000G

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Specification and Feature:

  • High precision K-type Closed Loop import from USA together with our company special heating way,the soldering rang of temperature within±1 degree
  • Imported optical alignment system with 15’’high definition monitor;high precision micrometer adjust X/Y/R axis;make sure the alignment precision within 0.01-0.02mm.
  • Top heater and mounting heater design 2 in 1 which can make the mounting more precision;there are many sizes of BGA nozzles which can meet different chips sizes,BGA nozzles can easy change,we accept customize.
  • High automatic and precision,Completely avoid human operation error; it is good for reworking lead free craft and double BGA,QFN,QFP,capacitance-type resistor components which can achieve good result.
  • Additional monitoring camera which can observe the solder ball melting and easy to check the temperature curve and the soldering result(optional function )

Technology Parameter:

Power 6800W
Up heater power 1200W
Down heater power 1200W
IR heater power 4200W(2400W control)
Power supply (Single Phase) AC 220V±10 50Hz
Position way Optical lens+ Vshape holder+laser positioning
Temperature control High precision K shape sensor(Closed Loop),up and down independent temperature heating zone,Precision can reach±1℃
Material High sensitive touch screen+temperature control module+PLC+step drive
PCB Size Max:500×450mm , Min: 10×10mm
Thermo-couple Ports 4pcs
Chips magnification times 2-30
PCB thickness 0.5-8mm
GA size 0.8mm-8cm
Min.chips pitch 0.15mm
Mounting BGA weight 1000G
Mounting precision ±0.01mm
Overall dimension L670×W780×H850mm
Optical alignment lens Motor drive can move front back right left
Weight of machine About 90kg

Product Tags:

0.8mm 8cm BGA Reballing Machine

      

BGA Reballing Machine Single Phase

      

0.8mm 8cm BGA ic remove machine

      
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